Diamond Back Grinding Wheels

Vitrified bond back diamond grinding wheel for integrated circuit silicon wafers

Metal bond diamond back grinding wheel for LED chips

Resin bond back diamond grinding wheel For LED chips

Back Grinding Wheels

Resin Bond
Metal Bond
Vitrified Bond

Wafer back grinding wheels are mainly used for grinding and thinning of semiconductor material substrates and wafers such as silicon, silicon carbide, gallium arsenide, indium phosphide, sapphire, etc. It is a core consumable material for semiconductor industry processing and semiconductor industry grinding wheels

Product

External Grinding Wheels

Internal Grinding Wheels

Surface Grinding Wheels

Centerless Grinding Wheels

Double Side Grinding Wheel

JIG Grinding Wheels

Fluting Grinding Wheels

The diamond back grinding wheel is widely used in the electronics industry such as LED chips and integrated circuit silicon wafers, which is mainly for back thinning and grinding semiconductor wafers.Diamond grinding wheels are the only option.

The processing objects include discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN chips, silicon-based chips, etc. It mainly used for back thinning, rough front grinding and fine grinding.

Types of Back Grinding Wheel

Metal Bond Back Grinding Wheel

This kind of metal diamond grinding wheel is mainly used for back thinning of sapphire epitaxial wafers, silicon chips, gallium arsenide, and GaN chips in the LED industry. The back grinding wheel for LED substrate has been exported to many countries, with superior grinding performance and high cost-effectiveness.

Features

High precision of the ground workpiece and good surface quality
Good shape retention of the workpiece
High grinding efficiency
Low grinding force and low grinding temperature

Vitrified Bond Back Grinding wheel

This series of vitrified diamond wheel is mainly used for back thinning and precision processing of semiconductor wafers, discrete devices, integrated circuit substrate silicon wafers, and raw silicon wafers.

Features

Using porous vitrified bonding agent with self sharpening
High feed rate, up to 500mm/min, greatly improving processing efficiency
Unique bonding agent formula, excellent processing quality, low wear of the grinding wheel itself, long service life

Can be customized according to customers’ requirements, providing suitable back grinding wheels for different machines and grinding processes.

Resin Bond Back Grinding Wheel

Resin bond back grinding wheel is made from thermoset resin and diamond, which is used for silicon wafers, sapphire, gallium nitride, gallium arsenide.

Features

Excellent self sharpening and elasticity
High processing efficiency and low processing temperature
High machining accuracy and surface quality

Parameters Of Diamond Back Grinding Wheel

a) Specification: In addition to conventional specifications, various single ring, multi ring, and helical thinning grinding wheels can be designed and manufactured according to customers’ needs.
b) Grain size: 230/270270/325400/500600/700
c) End face runout: ≤ 0.04mm
d) Outer circular runout: ≤ 0.05mm
e) Dynamic balance standard: G1

Application of Diamond Back Grinding Wheel Examples:

The LN-297D series wheel, which is matched with the NTS grinder, can grind approximately 18000pcs 2 inch substrate sheets, or 5000pcs 4 inch substrate sheets .
2. The LG-255D series wheel, which is matched with the GALAXY grinder, can grind approximately 2000pcs 4 inch substrate.
3. The LS-304D series wheel, which is matched with the SPEEDFAM grinder, can grind about 5000pcs 4 inch substrate sheets.