Resin Diamond wheel for Silicon Wafers

Diamond Chamfering Grinding Wheel for Crystal Silicon

Diamond wheel for Silicon Wafers

Flat Grinding
Chamfering Grinding
Rounding Grinding

Diamond wheel for silicon wafer is made of high-quality resin powder and diamond, which is produced by special technology. It features good sharpness and high surface quality.

Product

Internal Grinding Wheels

Surface Grinding Wheels

Centerless Grinding Wheels

Double Side Grinding Wheel

JIG Grinding Wheels

Fluting Grinding Wheels

Resin diamond wheel for silicon wafers is mainly used in the photovoltaic industry for rolling and grinding monocrystalline silicon rods, as well as for squaring, chamfering, and grinding polycrystalline silicon. There are resin bond diamond grinding wheel, with diamond grain sizes 120/140,W40, W28, W20, and etc.

Silicon is hard and brittle material with a Mohs hardness of 6.5. It can be made into polycrystalline silicon and monocrystalline silicon according to the application.

Monocrystalline silicon is a relatively active non-metallic element, which has a basically complete lattice structure and is a good semiconductor material with a purity of up to 99.9999%. It is mainly used in the manufacture of semiconductor devices and solar cells.The manufacturing method of monocrystalline silicon usually involves first producing polycrystalline silicon or amorphous silicon, and then growing rod-shaped polycrystalline silicon from the melt using the czochralski method or floating zone method.

Polycrystalline silicon is a form of elemental silicon. When molten elemental silicon solidifies under supercooling conditions, silicon atoms are arranged in the form of diamond lattice to form many crystal nucler. These crystal nuclei grow into grains with different crystal orientations, and when there grains combine, they crystallize into polycrystalline silicon.

Polycrystalline silicon is the direct raw material for the production of monocrystalline silicon and is the basic electronic information material for semiconductor devices such as contemporary artificial intelligence, automatic control, information processing, and photoelectric conversion.

Types of Resin Diamond Wheel for Silicon Wafers

Diamond Flat Grinding Wheel For Crystal Silicon

Flat grinding wheel is mainly used for cutting monocrystalline silicon rods and grinding the end faces of polycrystalline silicon ingots after square cutting. The parallelism of the two end faces of the processed crystalline silicon reaches 0.01mm, and the roughness reaches Ra 0.2 μ m. It is a type of face grinding wheel.

Diamond Chamfering Grinding Wheel for Crystal Silicon

Chamfering grinding wheel is mainly used for chamfering and trimming circular arcs of polycrystalline silicon ingots.

No chipping and prevent chip edge cracking and lattice defects, while increasing the flatness of photoresist layer.

Diamond Rounding Grinding Wheel for Crystal Silicon

Rounding Grinding Wheel for Crystal Silicon is a type of external cylindrical grinding, which is used for grinding the cylindrical surface of monocrystalline silicon rods and polycrystalline silicon ingots to obtain more accurate diameter dimensions and roundness requirements. Cylindrical grinding wheels require the use of grinding wheels with multi- grain sizes.

Test Data Of Resin Diamond wheel for Silicon Wafers :

Resin Diamond Wheel for Silicon Wafers for Rough Grinding

Sharp products:

It is suitable for machine for processing 182 silicon rods, with the maximum efficiency of 0.5mm feed rate and the feed speed of 20mm/s. It is suitable for other machine for processing 182 silicon rods, with the highest efficiency of 0.4mm feed rate and the feed speed can reach 35mm/s, and the product life can reach up to 120T or more.

High life product: When processing 182 rods, the life is more than 120T( feed rate 0.3mm, feed speed 25mm/s)

Resin Diamond Wheel for Silicon Wafers Fine grinding

Sharp products: When processing 182 rods, the maximum feed rate is 0.04mm, and the feed speed is 35mm/s, and the dressing interval is 15000mm.
Long dressing interval product: When processing 182 rods with an average dressing interval up to 90000mm, it can achieve the dressing internal of about 5 days, and the maximum service life can reach 300T.

In the entire process of manufaturring monocrystalline silicon and polycrystalline silicon from the ingots to the chips, different diamond tools are required for processing, and the accuracy requirements for processing are relatively high. The detailed steps, diamond tools, and indicators are shown in the table.