Resin Diamond Blade for cutting DFN Package
Diamond Blade for cutting DFN Package
The dicing blade is made of thermosetting resin powder as a binder and hot-pressed with diamond. It has good self-sharpening and excellent cutting ability. According to the advantages of the binder and the adjustment of different concentrations of abrasives, the cutting quality can be effectively controlled.
It can be used for precision cutting of various materials such as glass, ceramics, QFN, DFN, BGA, LGA, etc.
Diamond blade for DFN package is resin bond dicing blade with better sharpness, better cutting edges, and fewer burrs compared to metal bond diamond blades.
DFN package
DFN package( Dual Flat No let Package) is an extension package of QFN package( QFN is a name defined by the Japan Electronics Machinery Industry Association, abbreviated as Quad Flat No led Package). The pins of DFN package are distributed on both sides of the package and have a rectangular overall appearance, while the pins of QFN package are distributed on all four sides of the package and have a square overall appearance.
DFN Package Process
- Chip cutting: Separate chips from silicon wafers by dicing machine.
- Chip mounting: Paste the chip onto the substrate of the dual frame chip package.
- Pin connection: Connect the circuit of the chip to the circuit of the substrate by pin pads.
- Mold sealing processing: The dual frame chip is packaged in resin or other materials to achieve waterproof, dustproof and other protection.
- Edge cutting: Cut the edges of DFN package to ensure that the size and shape of the package meet the requirements.
Advantages of Diamond Blade for Cutting DFN Package
We have many years of experience in manufacturing the resin bond diamond dicing blades which is made of diamond and resin bond raw materials by multiple experiments and practical applications. Our resin diamond blade for DFN/QFN package has sharpness, good cut consistency,and no burrs, which has been approved by the customers. We can also customize the diamond dicing blades according to the cutting objects such as optical glass, ceramics, BGA, LGA, and other different materials.
Parameters of Diamond Blade for cutting DFN Package
A Cutting Case of Diamond Blade for Cutting DFN Package
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