Resin Dicing Blade for QFN Package

Diamond Dicing Blade for QFN Package

Main processing: DFN, QFN, PCB, BGA, LGA, glass, and other materials

By adjusting the concentration, binder and diamond particles, the dicing blade can effectively improve the processing quality, blade utilization rate and solve common quality problems, such as metal burrs, product delamination, pin tin melting, blade breakage during cutting, serpentine cutting, chipping, etc.

Product

Superabrasive Cutting Wheels

Resin diamond dicing blade for QFN package is made of diamond as raw material and resin bonding agent, with a hole in the middle. It is mainly used for IC process types such as QFN, DFN, BGA, etc.

How to Choose Dicing Blade for QFN Package?

The main question in cutting QFN packaging is the cutting of copper. Copper has good ductility and can deform but not rupture under tensile and compressive stress. During the cutting process, the material undergoes plastic deformation, the cross-section reaches the maximum load-bearing capacity, and then fractures. There will be large burrs between the deformation and fracture of the material. Whether can prevent the burrs after cutting copper materials and improve productivity has become the key factor in QFN processing.

The consumption of electroplated bonding agent blades in the radial direction is smaller than that on the side, resulting in relatively thin side surfaces. The quality of the cut product side surfaces will gradually decline with the wear of the blades. After a period of use, the blades may cause deformation of the chip shape and other problems.

The metal dicing blade has poor cutting consistency and obvious burrs.

The new resin bond diamond dicing blade is suitable for QFN dicing machine and used for high-quality cutting QFN with sharp cutting and no quality abnormalities such as burrs, fractures, and metal delamination detected under 40x microscope inspection.

QFN Package

QFN (Quad Flat No lead Package), one of the surface mount packages, is now commonly referred to as LCC. It is square or rectangular in shape, with a large exposed solder pad at the center of the bottom of the package for heat conduction, and conductive solder pads for electrical connection around the periphery of the package surrounding the large solder pad.

Main cutting features Of Qfn Package:

The main cutting object is the alloy frame. Due to the high-speed grinding process, the edge metal has ductility and has burrs, tin melting or delamination.

High cutting accuracy, high requirements for CPK value in appearance, high product added value, and high requirements for equipment reliability.

Our resin bond diamond dicing blade can effectively improve quality, blade utilization rate, and solve the common quality problems such as metal burrs, product delamination, pin soldering, cutting breakage, serpentine cutting and chipping by adjusting the concentration, bond and diamond grain size. The diamond dicing blade can be customized according to the type of IC packaing such as QFN, DFN, QFN, BGA, or other packaging types.