Metal Bond Diamond Dicing Blade
Hubless Metal Bond Diamond Dicing Blade
- High wear resistance
- High rigidity
- Used for electronic components
- Sharp Grinding
Metal bond diamond dicing blade can be used to process optical devices, ceramics, ferrites, quartz, IC packaging (BGA), optical communications , etc.
Ultra thin hubless metal bond diamond dicing blade is used for cutting electronic components, optics, ceramics, sapphire, optical glass, quartz, BGA/WLSCP packaging. It is made by sintering metal or alloy powder with diamond abrasive, which features high strength and long life.
Application of Hubless Diamond Dicing Blade
Features of Hubless Metal Bond Diamond Dicing Blade
- High wear resistance, most suitable for precision machining materials which is difficult to cut
- High rigidity , can suppress inclined cutting and serpentine cutting
- Used for electronic components, optics, ceramic, sapphire, optical glass, quartz, BGA, LGA, MEMS, CSP, QFN, PQFN, PCB, diode, transistor, etc semiconductor packaging products.
Specification & Accuracy of Hubless Metal Bond Diamond Dicing Blade
Manufacturing Process of of Hubless Metal Bond Diamond Dicing Blade
Notes for Ordering Diamond Dicing Blades
- Workpiece: name, specifications, dimensions before and after cutting
- Technical requirements: chipping, life, broken filament, slitting or workpiece size tolerance
- Cutting parameters: equipment, fixing method, flange size, speed, feed rate, cutting depth, whether to dress the blade, cooling method
- Hubless metal bond diamond dicing blade parameters: diamond grain size, diamond concentration, bonding agent, sintering process, end face condition, external slotting and parameters.
Notes for Metal Bond Diamond Dicing Blade
- Installation: Clean the flange thoroughly to avoid particle impurities, and other dirt.
- Dressing: Dressing and sharpening
- Current alarm point: Set the upper limit of current for each machine.
- Safety factor: For example, when testing, diamond dicing blade can cut 5000 meters, it should rule
4000 meters for batch use. According to different product thickness and different product materials, adjust the safety factor.
Cutting Case of 1A8 Metal Bond Diamond Dicing Blade
Blade specification: 58D×0.27T×40H
Cutting object: BGA package, workpiece thickness 1.1mm, cutting depth 1.2-1.3mm (cutting through)
Usage effect: The durability of the blade is 5000m, and the chipping of the cutting seam is less than 0.02mm.
Blade specification: 76.2D× 0.30T × 40H
Cutting object: PQFN package, workpiece thickness 0.8mm
Usage effect: The durability of blade is over 6000m, no chipping or delamination, sharp cutting, and excellent self sharpening performance.
Blade specification: 59D × 0.22T × 40H
Cutting object: Memory, workpiece thickness 1.0mm
Usage effect: The blade can cut more than 9000 meters without stress layering, no chipping but sharp cutting, and has excellent self sharpening performance.
After installation, it is recommended to use the dressing board to dress the metal bond diamond dicing blade to ensure that the dicing blade can reach the true circle during the cutting process. At the same time, diamond dicing blade should be sharpened to ensure that the diamond is exposed. If there is poor sharpness during the cutting process, it should promptly dress the blade.
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