Resin Diamond Dicing Blade
Hubless Resin Diamond Dicing Blade
- Good Easticity
- Thin Thickness
- High Precision
Our advanced diamond resin cutting technology is engineered to cut materials including, but not limited to, silicon, glass, ceramics, ferrites, fused silica, quartz, silicon carbide, GaN, and more.
Hubless resin diamond dicing blade is made by sintering diamond abrasive and resin bonding agent. It is suitable for processing glass, ceramics, magnetic materials, tungsten carbide, and various packaging materials, which has the characteristics of good elasticity, thin thickness, and high precision.
Features of Resin Diamond Dicing Blade:
- It has good elasticity and can improve thecutting abilityto the maximum extent.
- Good self sharpening, sharp cutting, and high processing efficiency.
- Develop new type bond diamond dicing blade to meetvarious needs based on the characteristics of the processed materials.
- Customers can customize different specifications diamond dicing blades according to their needs, and Effectively control the processing quality and service life by adjusting the concentration.
- New mixing and hot pressed technology can achieve uniform dispersion of nanomaterials without aggregation or agglomeration, while diamond distribution is uniform, ensuring stable product quality.
- Good universality andand match to the dicing machine in the international markets.
Application of Resin Diamond Dicing Blade
In the field of semiconductor packaging, resin bond diamond dicing blade can be used for cutting QFN, PQFN, and PCB.
Resin Diamond Dicing Blade is The Ideal Choice For Cutting QFN Packaging.
QFN packaging materials such as semiconductor chips, bonding wires and other packaging materials are easily affected by the heat from the laser or plasma cutting. And the heat can cause the precision components inside the package to melt and result in product defects. The cutting with resin bond diamond dicing blade is a clean and precise cold cutting treatment method.
Unlike harder materials such as ceramics and sapphire, QFN packaging materials are relatively easier to be cut and the cutting speed is much higher, reaching up to 25mm/s, with a relatively longer cutting life. Resin bond diamond dicing blade has high cutting accuracy and sharpness, making it the ideal choice for cutting QFN packaging.
In the field of ceramic materials, resin bond diamond dicing blade can be used for cutting silicon carbide, zirconia, etc.
Ceramics are both hard and fragile, and are easily broken or shattered when cutting. Resin bond diamond dicing blade can be used for cutting ceramics, which can prevent the defects such as broken or shattered.
Resin bond diamond dicing blade can perform precise cutting while minimizing the material lost during the cutting process, thereby achieving high yield and minimal waste. Other methods such as plasma cutting or laser cutting may not be suitable for cutting ceramics.
Application in the field of silicon wafer cutting
Silicon wafers are widely used in various electronic devices. Resin bond diamond dicing blade is an ideal choice for cutting silicon wafer and semiconductor. It provides precise and fast cutting with minimal damage to silicon wafers.
In the field of glass materials, it can be used for cutting optical glass, quartz glass, etc. In the field of metal materials, it can be used for tungsten carbide and rare earth magnetic materials.
Product parameters Of Resin Diamond Dicing Blade
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