`The factors affecting the quality of diamond dicing blade are under continuous research.In the past 40 years, diamond dicing blade and cutting systems have been continuously improved to meet the technological challenges and requirements for cutting different types of materials. The impact of blade and cutting process parameters on cutting quality has been constantly studied, so that the cutting can meet the constantly changing of chip materials.
In terms of manufacturing of diamond dicing blade for wafer, there are five factors that affect the blade features and even wafer dicing blade. This article focuses on analyzing the impact of these factors to help people for choosing cutting tools.
Diamond Grain Size Influence Quality Of Diamond Dicing Blade
Diamond is mainly involved in cutting and processing, and the bonding agent mainly plays a role in bonding diamond. Different sizes of diamond grains affect cutting quality is more obvious. Large diamond particles have a larger impact force, resulting in larger cracks in the workpiece.
According to the characteristics of the grinding principle, the larger the diamond grain size, the larger the impact force on the wafer, resulting in a larger front chipping size. The larger the diamond grain size, the less the blade block, which can effectively reduce the risk of chipping on the back of the product. The impact force of small diamond particles is relatively small, and the size of the front chipping size is also small.
According to the characteristics of the grinding principle, the larger the diamond grain size, the larger the impact force on the wafer, resulting in a larger front chipping size. The larger the diamond grain size, the less the blade block, which can effectively reduce the risk of chipping on the back of the product. The impact force of small diamond particles is relatively small, and the size of the front chipping size is also small.
However, When the chip is relatively thin , the impact force large diamond grains is too strong, and the thin chip cannot withstand a large impact force. The size of diamond grains also affect the life of diamond dicing blade. The larger the diamond particles, the longer the blade life. The smaller the particles, the shorter the life of the blade. In addition, high-quality diamond can enhance the sharpness and life of dicing blades.
Bonding Agent Strength Influence Quality Of Diamond Dicing Blade
The sharpness and life of diamond dicing blade can be controlled by adjusting the hardness of the bonding agent. The softer the bonding agent of diamond dicing blade, the better the self sharpening of the blade, and diamond particles on the blade are always in a sharp state, which can reduce the problems of front chipping, delamination and burrs .
The sharpness and life of diamond dicing blade can be controlled by adjusting the hardness of the bonding agent. The softer the bonding agent of diamond dicing blade, the better the self sharpening of the blade, and diamond particles on the blade are always in a sharp state, which can reduce the problems of front chipping, delamination and burrs .
The increase in the hardness of the bonding agent improves the life of dicing blade, but it also result in a decrease in sharpness and an increase of dressing blade.
Blade Thickness and Length Influence Quality Of Diamond Dicing Blade
Blade Thickness Increase:
Advantages: It vibrates less during the cutting process to ensure the cutting quality. The blade has high strength and does not break.
Disadvantages: High cutting resistance, large debris, slow feed rate.
Blade Thickness Reduce:
Firstly, the contact area of the cutting is small, the resistance is low, and the feed speed is fast. Secondly, the blade vibration is small to ensure the cutting quality. Thirdly, the blade strength is small and break easily.
Advantages: Low cutting resistance, faster cutting speed, and less chipping.
Disadvantages: The blade strength is small , and it break easily, and serpentine cutting.
Blade Height
- The longer the blade height, the longer the life. The blade strength is low, and the slow feed rate can cause blade to break. Fast feed rate can cause deviation and serpentine cutting.
- The shorter the blade, the shorter the life of blade, the stronger the blade strength, the faster feed rate, and it less break. The vibration is small and less deviations.
Blade Dressing Influence Quality Of Diamond Dicing Blade
The effect of blade dressing is to expose the diamond on the surface of the blade, use the dicing blade dressing board and adjust the eccentricity of the blade, hub,and flange. When the new blade on the spindle and flange, although the blade touches the top of the spindle, there is still a gap between the spindle and flange, which is the eccentricity of the blade. If there is eccentric for blade , as long as the blade is partially working and the load is too large, it will reverses cutting which affect the product quality.
Other factors such as feed rate and spindle speed may also affect the performance of the blade. The cutting parameters have a direct impact on the material removal rate, which in turn affect the performance and process efficiency of the blade. New Diamond company will make a in-depth research on these rules to meet the demands in the precision cutting process of many materials in the mar
The size of the diamond dicing blade, diamond abrasive size, diamond concentration, bond type determine the life and cutting quality of diamond dicing blade. Changing any parameter will directly affect the performance of the dicing blade. Our company provides electroplated bond, metal bond dcing blade, and resin bond dicing blade.
