In the process of wafer cutting, selecting the appropriate dicing blade is the most important step. In the later stage, need optimize the parameters of the cutting equipment. According to different cutting objects, adjust the equipment parameters such as feed rate and spindle speed of dicing machine to achieve good cutting results. There is no standard here, but a theoretical reference.
Common Cutting Quality Issues
Chipping
Front chipping is mainly on the cutting surface of the wafer, while back chipping refers to the chipping on the back of the wafer. Both front and back chipping are not allowed during wafer dicing. The reasons for chipping include.(Click Refer Article : How to solve the problem chipping in wafer saw !)
- Inappropriate cutting parameters lead to chipping (feed rate and spindle speed).
- The blade is severely worn, and the passivated blade edge increases the irregular force during the cutting process, thereby increasing the possibility of chipping. Diamond and other abrasive particles in the blade collide with the wafer surface material during the cutting process, resulting in chipping.
Cutting Burrs
Burrs are tiny material residues formed at the cutting edge of the wafer, which not only affect the appearance of the chip, but also have a negative impact on the performance and subsequent processing steps of the chip.
What Is The Spindle Speed Of Dicing Machine?
Dicing blade is fixed on the spindle of the precision cutting equipment and rotates at a very high speed. The spindle speed is usually between 10000-60000RPM. The rotation speed of the blade is one of the key factors affecting the cutting effect.
It should be noted that at the same rotational speed, the outer diameter of the blade is different, and the outer circumferential velocity is also different. The larger the outer diameter of the blade, the higher the outer circumferential velocity , as shown in the following figure:
In order to achieve the same outer circle linear velocity with different outer diameters blade, the rotational speed must be adjusted to ensure cutting quality and stability.
Influence Of Spindle Speed On Blade Life
When the spindle speed increases, the cutting ability of the diamond blade improves, the processing load of diamond decreases, thereby improving the blade life and reducing the risk of front chipping of the cut product.
On the other hand, reducing the load of diamond processing will hinder the self sharpening of the blade, which often leads to an increase for back chipping. At this time, reducing the spindle speed and accelerating the self sharpening of the blade is one of the effective measures to reduce back chipping.
In the actual cutting process, it is necessary to consider the bond type of the dicing blade： resin bond, metal bond, and electroplated type.
Influence of spindle speed on cutting quality
Changes in front and back chipping size at different spindle speeds
Under the same cutting conditions, the higher the spindle speed, the smaller the front chiping size of the cut product, and the larger the back chipping size.
Changes In Front Cutting Tool Marks At Different Spindle Speeds
Under the same cutting conditions, the higher the spindle speed, the higher the probability of blade serpentine cutting.
In order to maintain good front and back cutting quality performance of the cut product and achieve the expected service life, it is necessary to choose a spindle speed balance point.
Balance Point Between Spindle Speed And Machining Quality
Due to the impact of spindle speed on the front and back chipping size and blade life, it is necessary to balance the spindle speed based on the cut product, blade specifications, and processing quality standards.
Diamond Dicing Blade Collection
For different cutting objects and requirements, pre cutting should be carried out according to the actual situation. Choose the optimal parameter combination by adjusting the parameters of various cutting machines, and the quality of wafer is good, and the number of cuts per unit time should be more, and the consumption of diamond dicing blade should be minimized.
